Beijing Borei Advanced Technology Co., Ltd.

Borey Advanced & ASMPT: The Core Solution for High-Speed SiP Mounting

2025-08-04

As the trend toward智能化 accelerates, electronic products are steadily evolving toward smaller form factors and higher performance. System-level packaging (SiP) is increasingly emerging as a pivotal technology in realizing this trend. By integrating IC chips and SMT components into a single package, SiP effectively enhances system performance while dramatically reducing product size—making it one of the key pathways for advanced packaging solutions.

However, when dealing with complex packaging structures and increasingly demanding performance requirements, traditional SiP production lines typically need to separately carry out two distinct processes—SMT mounting and chip bonding. This approach leads to a wide variety of equipment types, complicated operations, and fragmented workflows, which not only drive up production costs but also constrain the line’s flexibility and response speed.

For this, ASMPT Introducing the SIPLACE CA2, which integrates SMT placement and wafer chip mounting into a single machine, breaking away from traditional segmented processes and truly enabling a seamless " A single machine can handle two processes. ", for SiP Packaging Mass production offers a more efficient, flexible, and forward-thinking solution.

A single machine handles two processes.

SIPLACE CA2 integrates SMT and semiconductor mounting processes into a single, unified operation, enabling simultaneous handling of reel-based components. SMD Components include bare chips taken directly from wafers. The mounting speed reaches up to 50,000 chips or 76,000 SMDs per hour, with an accuracy of 10 μm @ 3σ , significantly enhancing line flexibility, production capacity, and yield rates—particularly well-suited for a variety of high-speed SiP production applications.

The SIPLACE CA2 not only supports multi-tasking on a single machine but also significantly reduces the space and labor costs previously required when multiple devices worked together. Its highly automated chip buffering system enables simultaneous pre-fetching of chips while the mounting head is in operation, allowing parallel processing of wafer retrieval and component placement. This approach brings chip-handling efficiency close to traditional SMT cycle times—while dramatically minimizing production bottlenecks and reducing downtime during line changes.

End-to-end intelligent automation, from chips to factories

The SIPLACE CA2 not only boasts highly efficient wafer-handling capabilities—switching can be completed in as little as 6.5 seconds—and supports up to 50 different wafer types. Moreover, by directly processing bare chips without the need for tape handling, it helps customers cut material costs, minimize waste, and enhance sustainability.

Meanwhile, SIPLACE technology, with its "comprehensive, individual bare-chip-level tracking capability," can automatically record the pick-up location of each chip as well as its mounting position on the circuit board, ensuring compliance with the stringent reliability standards of the industry.

In collaboration with ASMPT's WORKS software and IPC-CFX, SECS /GEM and other standardized interfaces enable SIPLACE CA2 to seamlessly integrate with MES and automated logistics systems, helping to build the smart factories of tomorrow.

A strategic platform designed for the future

Sylvester Demmel, Senior Product Manager at ASMPT’s SMT Solutions Division, summarized the strategic significance of SIPLACE CA2 by saying: "SIPLACE CA2 brings together the key capabilities of the SiP era, paving the way for a new frontier in advanced packaging."

By integrating SMT with chip mounting into a single process, the SIPLACE CA2 not only helps customers tackle the challenges of advanced packaging but also empowers electronic manufacturers Pioneered new market opportunities and customer segments While boosting both production capacity and quality, it also effectively reduces operational costs, creating a brand-new competitive edge.

SIPLACE CA2 is the result of ASMPT's ongoing technological advancements in the fields of advanced packaging and intelligent manufacturing. It’s not just an equipment upgrade—it embodies a completely new manufacturing philosophy centered on efficiency, sustainability, and intelligence, helping customers respond to technological evolution with greater speed and superior quality.

In this era of system-level packaging accelerating transformation, SIPLACE CA2 brings the vision of "future packaging" within reach.