Borey Advanced and ASMPT Launch New Fixed Camera Designed Specifically for SIPLACE Pick-and-Place Machines

ASMPT, a global leader in market and technology solutions for semiconductor and electronics manufacturing, has announced the launch of a new fixed camera designed to work seamlessly with SIPLACE pick-and-place machines, specifically the CPP and TWIN mounting heads.

 

This camera significantly enhances mounting speed and component compatibility, catering to a full range of application sizes—from high-density ball grid arrays (BGAs) to large, irregularly shaped components (OSCs)—and sets a new industry benchmark for electronic manufacturing.

 

Starting today, SIPLACE pick-and-place machines equipped with SIPLACE CPP and TWIN mounting heads can now be fitted with the new Model 56 camera, featuring a large 66mm × 50mm inspection field of view and an ultra-high resolution of 16.2μm per pixel.

Application of Fixed Camera No. 56 in the SIPLACE SX Pick-and-Place Machine

Full-Size Inspection Achieves Two-Way Breakthrough

Thanks to its outstanding high-resolution capabilities, this new fixed camera has achieved a two-way breakthrough in the ability to perform full-size inspections of components.

 

First is the detection capability for tiny components. The new camera can precisely capture micro-solder balls as small as 80 μm in diameter, a feature that marks a significant improvement in detection clarity. Specifically, when inspecting the intricate Ball Grid Array (BGA) structures found on AI chips, this camera achieves an imaging pixel count per solder ball that is six times higher than traditional systems, leading to a dramatic increase in defect detection rates.

 

Secondly, in terms of large-component measurement, this camera leverages its high resolution to deliver fast and precise 3D measurements of specialized components—making it the preferred solution for the automotive manufacturing industry.

 

Supports rapid retrofitting and upgrades

Sven Buchholz, Vice President of Product Portfolio Management at ASMPT’s SMT Solutions Division, stated: "The new fixed-camera system enables rapid retrofitting and upgrades of existing equipment, delivering significant improvements for electronics manufacturers in three key areas: quality control, placement performance, and component compatibility. Not only does this system reliably handle highly precise BGA components, but it also fully automates the previously manual and complex process of mounting oddly shaped components (OSC), eliminating the need for labor-intensive operations."

Synergistic Performance with the SIPLACE Mounting Head

This new fixed camera works in tandem with the SIPLACE placement head, delivering a significant technological leap in both mounting speed and flexible production capabilities.

The software-flexible SIPLACE CPP placement head seamlessly switches between "pick-and-place," "collect-and-place," and hybrid modes, precisely meeting a wide range of production requirements. This performance ensures that the production line can continue running smoothly even during frequent product changes, eliminating the need for time-consuming configurations or the replacement of mounting heads.

On the other hand, the SIPLACE TWIN placement head stands out as a high-precision pick-and-place head designed specifically for large, heavy, and complex components—delivering exceptional performance even at the line end. Notably, the TWIN VHF version excels in accurately handling components weighing up to 300g, with finely adjustable placement pressure that can reach a maximum of 100N, fully demonstrating its robust processing capabilities.