Beijing Borei Advanced Technology Co., Ltd.

Bo Rui Advanced — What Are the Common Defects in SMT Chip Soldering?

2024-05-24

1. Component Quality Issues: The initial stage of SMT soldering relies heavily on the quality of the components. If component leads are oxidized, contaminated, or deformed, it may result in poor solder joints.

2. Solder Paste Selection and Printing Issues: As an essential medium for connecting components to the PCB, the quality, printing volume, and precision of solder paste directly influence the soldering outcome.

3. PCB Design and Quality: The design rationale of the PCB board—such as pad design, solder mask window dimensions, and copper foil thickness—directly influences soldering quality.

4. Process Parameter Setting: Properly setting the reflow soldering temperature profile is crucial. Temperatures that are too high or too low, as well as excessively long or short heating/cooling times, can all lead to insufficient solder melting or overly rapid cooling.

5. Equipment Precision and Stability: The precision, speed of the SMT pick-and-place machine, and the temperature control accuracy of the reflow oven are all critical factors affecting soldering quality.