Borey Advanced: Chip Mounter Placement Efficiency Declines

2024-03-13


 

1. First, the pick-and-place machine nozzle may suffer from insufficient vacuum pressure. Before picking up a component, the nozzle automatically switches the mechanical valve on the mounting head—from blowing air to creating a vacuum suction, thus generating the necessary negative pressure. If the negative-pressure sensor detects that the pressure remains within the specified range after the component is picked up, the machine operates normally; otherwise, component adhesion becomes unreliable. Second, pressure leaks in the air supply circuit can occur due to aging or cracking of rubber air tubes, wear and tear of seals, or gradual deterioration from prolonged use of the nozzle itself. Additionally, contaminants like adhesive residue or dust from the surrounding environment—especially the substantial debris generated when cutting components packaged in paper tape—can clog the nozzle over time.

 

2. Errors in the settings of the pick-and-place machine program can also reduce its mounting efficiency. The solution is for the machine manufacturer to increase training efforts for customers, enabling them to get up to speed more quickly.

 

3. The quality of the electronic components themselves plays a critical role—when the nozzles pick up these components for placement, issues may arise such as incomplete insertion of the component pins into the surface mount machine, or even bending or breaking them outright. To prevent such problems, it’s essential to ensure high-quality standards when sourcing the components themselves. Not only does this directly impact assembly efficiency and product quality, but frequent handling of these delicate components by the nozzles can also lead to varying degrees of damage over time. Over the long run, this wear and tear will inevitably shorten the lifespan of the nozzles.


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