Bo Rui Advanced — What Preparations Are Needed Before SMT Pick-and-Place Machine Processing
2024-01-29
First, the PCB test content:
1. Is the bare PCB warped, and is its surface smooth?
2. Is there oxidation on the circuit board pads?
3. Is the copper plating on the circuit board exposed?
4. Has the printed circuit board been baked for the specified duration?
The following items must be checked before solder paste printing:
1. Boards must not be stacked vertically, and no collisions are allowed between the boards;
2. Do the positioning holes align with the template openings?
3. Can solder paste be thawed in advance at room temperature?
4. Whether the solder paste is correctly selected and whether it has expired;
5. Does the SPI solder paste inspector have calibration data?
6. Are the steel mesh and mold designs cleaned, and is there any solder paste residue on the surface?
7. Whether a warping test is conducted on the wire mesh material;
8. Have the scraper machine's parameters been calibrated and adjusted?
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