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Borey Advanced ASMPT launches new fixed camera dedicated to SIPLACE surface mount machine

2025-07-22

ASMPT, a leading global semiconductor and electronic manufacturing solutions market and technology provider, announced the launch of a new fixed camera compatible with SIPLACE surface mount machine CPP and TWIN mounting heads.

This camera significantly improves the mounting speed and component compatibility, covering full-size application scenarios from high-density ball grid arrays (BGA) to large shaped components (OSC), setting a new benchmark for the electronics manufacturing industry.

Starting today, SIPLACE SMT machines equipped with SIPLACE CPP and TWIN mounting heads can be equipped with the new Type 56 camera, which has a 66mm × 50mm large field of view detection area and 16.2 μ m/pixel ultra-high resolution.

Support rapid modification and upgrade

Sven Buchholz, Vice President of Product Portfolio Management at ASMPT SMT Solutions, said, "The new fixed camera system supports rapid retrofitting and upgrading of existing equipment, bringing significant improvements to electronic manufacturers in quality control, mounting performance, and component compatibility. The system can not only reliably handle high-precision BGA components, but also fully shift the traditional manual operation based complex shaped component (OSC) mounting process to automated production

Synergistic efficiency with SIPLACE mounting head

This new type of fixed camera works in conjunction with SIPLACE mounting heads, achieving a technological leap in mounting speed and flexible production capacity.

The SIPLACE CPP mounting head, which can be flexibly controlled by software, seamlessly switches between "picking mounting", "collecting mounting", and mixed modes to accurately adapt to various production needs. This performance ensures that the production line can continue to operate stably during high-frequency product switching, without the need for tedious configuration or replacement of mounting heads.