Borui Advanced — SMT Pick-and-Place Machine Weld Joint Quality Inspection

2024-04-18


4. No虛welding, unstable welding, or other defects should be present.

1. The surface gloss of the solder joints must meet production requirements and must not exhibit any defects.

2. The aspect ratio of components should be moderate, ensuring that the appropriate amount of SMT solder material is used—and that this material fully covers the soldering areas on both the pads and leads.

3. It exhibits excellent wettability; the edges of the soldering joints should be relatively thin. The wetting angle between the solder material and the surface of the pad is recommended to be below 300 degrees, with a maximum not exceeding 600 degrees.

 

 

II. Visual Inspection of SMT Processing:

1. No missing components are allowed;

2. No components must be incorrectly placed;

3. No circuit board short circuits are allowed;

4. No虚welding, unstable welding, or other defects should be present.

 


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