Several Standard Issues to Pay Attention to in Borey Advanced SMT SMT Chip Processing



Firstly, a joint standard for the development of electrostatic discharge control programs. This includes the necessary design, establishment, implementation, and maintenance of electrostatic discharge control programs. Provide guidance for handling and protecting electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.

Second: Welding Technology Evaluation Manual. Including 45 articles on various aspects of welding technology, covering ordinary welding, welding materials, manual welding, batch welding, peak welding, reflow welding, gas phase welding, and infrared welding.

Thirdly, a manual for cleaning the half water after welding. Including various aspects of semi aqueous cleaning, including chemical, production residues, equipment, processes, process control, as well as environmental and safety considerations.

Fourth: Desktop reference manual for evaluating through hole welding points. Provide detailed descriptions of components, hole walls, and welding surface coverage in accordance with standard requirements, in addition to computer-generated 3D graphics. Covering tin filling, contact angle, tin sticking, vertical filling, solder pad coverage, and numerous welding point defects.

Fifth: Template Design Guidelines. Guidelines were provided for the design and manufacturing of solder paste and surface mount adhesive coating templates. Template design using surface mount technology was also discussed, and hybrid technologies with through-hole or flip chip components were introduced, including overprinting, double printing, and stage based template design.

Sixth: Cleaning manual after welding. Describe the types and properties of manufacturing residues, cleaning agents, cleaning processes, equipment and processes, quality control, environmental control, employee safety, and the cost of measuring and measuring cleanliness.