Reasons and Solutions for Material Throwing in SMT Chip Placement Machine Processing


The so-called material throwing refers to the process where the SMT machine does not stick the material after absorbing it during production, but instead throws the material into the throwing box or other places, or performs the above throwing action without absorbing the material. Material throwing causes material loss, prolongs production time, reduces production efficiency, and raises production costs. In order to optimize production efficiency and reduce costs, it is necessary to solve the problem of high material throwing rate.


The main reasons and countermeasures of SMT chip placement machine throwing materials in SMT chip processing

1. Suction nozzle problem

The suction nozzle is deformed, blocked, or damaged, resulting in insufficient air pressure and leakage, resulting in the inability to lift the suction material, incorrect material retrieval, and inability to identify and discard the material.

Countermeasure: Clean and replace the suction nozzle.

2. Identify system issues

Poor vision, unclean vision or laser lens, interference from foreign objects in recognition, improper selection of recognition light source and insufficient intensity and grayscale, and the possibility of recognition system malfunction.

Countermeasure: Clean and wipe the surface of the recognition system, keep it clean and free of debris, adjust the intensity and grayscale of the light source, and replace the recognition system components.

3. Location issues

The material is not in the center position of the material, and the height of the material is incorrect (usually based on pressing down 0.05mm after touching the part), resulting in deviation. The material is not correct, there is deviation, and during recognition, it does not match the corresponding data parameters and is discarded as invalid material by the recognition system.

Countermeasure: Adjust the picking position.

4. Vacuum issues

Insufficient air pressure, unsmooth vacuum tube passage, blockage of vacuum passage due to conductive material, or leakage of vacuum causing insufficient air pressure and inability to pick up the material or falling during the process of removing the adhesive.

Countermeasure: Adjust the pressure gradient to the required pressure value of the equipment (such as 0.5-0.6Mpa - YAMAHA mounting machine), clean the air pressure pipeline, and repair the leaking air path.

5. Procedural issues

The component parameters in the edited program are not set correctly, and do not match the dimensions, brightness, and other parameters of the incoming material, resulting in recognition failure and being discarded.

Countermeasure: Modify component parameters and search for the optimal parameter settings for components.

6. Issues with incoming materials

The incoming materials are irregular, resulting in unqualified products such as pin oxidation.

Countermeasure: IQC should conduct incoming material testing and contact component suppliers.

7. Feeder issues

The position of the feeder is deformed, and the feeding of the feeder is poor (the feeder spur gear is damaged, the material belt hole is not stuck on the spur gear of the feeder, there are foreign objects below the feeder, the spring is aged, or there is electrical defects), resulting in missing or poor feeding and throwing, as well as damage to the feeder.

Countermeasure: Adjust the feeder, clean the feeder platform, and replace damaged components or feeders.