Borey Advanced - Do SMT SMT surface mount processing?




1、 Electronic products have small size and high assembly density

The volume of SMT surface mount components is only about 10% of that of traditional packaging components, and the weight is only 10% of that of traditional plug-in components. SMT technology can usually reduce the volume of electronic products by 40% to 60%, reduce quality by 60% to 80%, and greatly reduce both area and weight. The SMT surface mount machining assembly component grid has developed from 1.27mm to the current 0.63mm grid, with some reaching 0.5mm grid. By using through-hole installation technology, assembly density can be improved.

2、 High reliability and strong vibration resistance

SMT chip placement processing uses chip shaped components, which have high reliability, small size, light weight, strong vibration resistance, automated production, high installation reliability, and generally have a defect solder joint rate of less than 10 parts per million. It is one order of magnitude lower than through hole insertion component wave soldering technology, which can ensure a low solder joint defect rate in electronic products or components. Currently, nearly 90% of electronic products use SMT technology.

3、 Good high-frequency characteristics and reliable performance

Due to the firm mounting of chip components, they are usually without or with short leads, which reduces the influence of parasitic inductance and capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference. The maximum frequency of the circuit designed with SMC and SMD can reach 3 GHz, while the chip component is only 500 MHz, which can shorten the transmission delay time. Can be used in circuits with clock frequencies above 16MHz. If MCM technology is adopted, the high-end clock frequency of computer workstations can reach 100 MHz, and the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.

4、 Improve productivity and achieve automated production

At present, in order to achieve complete automation of perforated installation of printed boards, it is necessary to expand the original printed board area by 40%, so that the insertion head of the automatic plug-in can be inserted into the components, otherwise there will be insufficient clearance and the parts will be damaged. The automatic SM421/SM411 mounting machine uses a vacuum nozzle to suction and discharge components. The vacuum nozzle is smaller than the shape of the components, which actually increases the installation density. In fact, small components and fine pitch QFP machines are produced by automatic SMT machines to achieve full line automatic production.

5、 Reduce costs and expenses

(1) The usage area of printed boards has been reduced, with an area of 1/12 of that of through hole technology. If CSP installation is used, its area will also be significantly reduced;

(2) Reduce the number of drill holes on printed boards and save rework costs;

(3) Due to the improvement of frequency characteristics, the cost of circuit debugging is reduced;

(4) Due to the small size and light weight of chip components, packaging, transportation, and storage costs are reduced;

The SMT surface mount processing technology can save materials, energy, equipment, manpower, time, etc., and reduce costs by up to 30% and 50%!!