Borey Advanced - SPI's role in SMT SMT SMT placement machine production



1. Ensure welding quality: In SMT production, correct solder paste printing is a prerequisite for achieving good welding. Through SPI testing, it can be seen whether the distribution of solder paste after printing is uniform and whether the printing is in place.

2. Improve production efficiency: SPI's automated testing can significantly reduce the need for manual inspection and improve the running speed of the production line. In addition, by identifying issues early on, SPI can help reduce rework and scrap rates, thereby lowering production and time costs.



3. Data driven production optimization: The detailed data provided by the SPI system can be used to further analyze the problem points in the production process.

4. Improving product quality: In various industries, product quality is the key to ensuring user satisfaction and increasing brand awareness. SPI is the key to ensuring product quality in SMT processing. SPI ensures that the solder paste printing on each PCB meets consistent standards, providing a solid foundation for subsequent component mounting.